What are the factors that affect the quality of the negative ion switch?

It is well known that negative ion switches have great practical value in seemingly insignificant shapes. When we use the negative ion switch, we can not only feel its excellent conductivity, convenient control mode, but also feel its comfortable touch. As for the optical contact switch itself, it has a precise structure, material, process, etc. Among the many factors, what are the factors that affect the comprehensive quality of the negative ion switch? Let's look at it together.

For tact switches, the material and coating of the springs and contacts are important. The material and process of shrapnel and contact should not only consider its electrical performance, but also its service life. Generally speaking, in order to reduce the contact resistance between the shrapnel and the contact, brass or phosphor copper is usually used, and silver plating is used for electroplating. If it is a nail, silver plating can isolate the SO2 gas in the air and keep it away from corrosive elements; but the anti-corrosion time is short. Choose from brass or phosphor bronze pins.

Therefore, the material, thickness and process of the silver plating layer become the key to determine the comprehensive performance of the pin. In today's market, the thickness of the silver plating on the market is more than 0.3 μm, and it can even be three times the thickness of the inferior. The silver plating process also has a wide range of effects. Some pins are directly plated with silver, and some use multi-layer plating process, nickel plating or pre-copper plating. Five kinds of micro negative ion switches Today, we will explain some common problems of micro negative ion switches! We summarized some plug-ins, patches, side pressure, lights, waterproof switches, etc.

Common problems with plug-in negative ion switches: Plug-in negative ion switches are suitable for manual welding and wave soldering, because the temperature resistance of the welding process is not very high, which brings many bad opportunities to manufacturers. In order to save costs, many defective manufacturers have replaced the original PA66 plastic base with POM material. Even if the material is replaced, the recycled material will be added in different proportions. Five kinds of micro negative ion switch chip negative ion switch FAQ: Chip negative ion switch is one of the common switches. The machine can save labor costs, so the chip negative ion switch is one of the good choices. However, many customers are concerned about this because once a switch has a problem, it is difficult to fix it. In fact, this switch is easy to do. The material used was PA9T or LCP. These two materials are not difficult for the reflow process.

In order to save costs, some manufacturers use PA66 or low-end materials, so problems will follow. Common problems of SMT negative ion switches include: temperature resistance of the switch, hand attenuation, melting of the key handle, bubbling of the switch base, non-conductive when the switch is pressed lightly, key stuck, etc. First, press the switch pin on the side to connect with the inside, which is the key because our pins need to be soldered. If the mold accuracy of the switch is not enough, there will be a small gap between the pin and the plastic body, leaving us a chance to leave rosin; secondly, it is also important to draw the switch gasket according to the drawings provided by the manufacturer. Remember not to be too big or too small, as this will directly affect the amount of tin on the back. The tin content of most customers should be controlled between 0.1 and 0.13, which is very appropriate; third, the switch is a very precise product, and the materials we use are also very important. We have said more than once that high-temperature resistant materials must be used to avoid plastic deformation of the material after welding, which may cause the switch key to jam.